Union Minister of Information Technology Ashwini Vaishnaw has mentioned that India’s semiconductor mission is progressing at a very fast tempo and step-by-step milestones are being achieved.
“India’s semiconductor mission is progressing at a very fast pace. Step-by-step we are achieving new milestones,” the Union Minister mentioned.
Further talking on India’s semiconductor program, the Union Minister mentioned, “Today, Japan and India signed a memorandum of co-operation for semiconductor development, manufacturing, research, design and talent development.”
The settlement was signed between Vaishnaw and Japan’s Minister of Economy, Trade and Industry Yasutoshi Nishimura within the nationwide capital.
“Japan and India have signed a memorandum for semiconductor design, manufacturing, equipment research, talent development and to bring resilience in the semiconductor supply chain,” Vaishnaw mentioned.
The nations will create “implementation organisation” that may work on government-to-government and industry-to-industry cooperation, Vaishnaw added.
ALSO READ |Â Foxconn withdraws from Rs 1.5 lakh crore semiconductor three way partnership, Vedanta says different traders lined up
ALSO READ |Â Gujarat govt, US agency Micron signal MoU for semiconductor plant in Sanand days after PM Modi’s US go to
