M&M signs MoU with NXP Semiconductors to build connected, safer SUVs

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M&M signs MoU with NXP Semiconductors to build connected, safer SUVs


Mahindra & Mahindra Ltd. (M&M) mentioned it has signed an MoU with NXP Semiconductors, which is into offering safe connectivity options for embedded functions to collectively discover the electrical and related automobile panorama, overlaying a variety of automobiles together with utility automobiles, mild business automobiles, farm gear, and tractors.

Rajesh Jejurikar, Executive Director & CEO – Auto and Farm Sectors, M&M mentioned the corporate would discover alternatives to leverage NXP’s superior applied sciences and options to build SUVs which can be safer, extremely related, and environmentally pleasant. 

“We are driven by our mission to elevate people’s quality of life through innovative and cutting-edge technology. Together, we endeavour to shape the future of smart electric mobility and deliver extraordinary experiences to our consumers,” he mentioned.

Kurt Sievers, President & CEO, NXP mentioned, “By working together and leveraging our rich portfolio of technologies, solutions and expertise, NXP and M&M are charting a course to build a brighter tomorrow.”

Mahindra can even get entry to NXP’s accomplice ecosystem, comprising Tier 1, ODM, IDH, module distributors, and integrators. 



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